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30ML EFD Adhesive Underfill Sealant used for BGA, CSP
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NO PUR adhesive
product description: Applied to flip chip, CSP and BGA, through the capillary flow to form a uniform and void-free underfill layer, to disperse the stress caused by the welding material to improve the bending, vibration, drop or high temperature cycle of the assembly reliability. Product Features: 1. Fast curing with one component, wide application range, simple operation process; 2, fast flow, uniform and seamless filling; 3. Anti-seismic, high-low temperature impact, easy to repair;
The main purpose: 1. Four-corner bonding for chips; 2. Four-edge cofferdams for chips; 3, for the bottom of the chip; a single component, epoxy liquid filling material 2. Low temperature curing, good weather resistance, repairable. 3. Mainly used to protect CSP, BGA, UBGA after assembling. For example: cellular phones, notebook computers. 4. At room temperature (23 ± 2 ℃) warmed 3h be back to normal viscosity before use, do not open the package in the previous 5. Factory directly, low price, OEM service. 6. Free sample.
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