product description:

Widely used in the thermal conduction of sensitive electronic components, such as high-power tube, thyristor, inverter module and other radiator parts. The product forms a good thermal conduction path between the sensitive electronic components and the heat-dissipating substrate, so that the operating temperature of the device is reduced below the critical point, and the service life of the components is greatly extended.

Product Features:

1, high thermal conductivity;

2, superior resistance to high and low temperature performance, high temperature does not flow, not easy to settling, no hardening;

3, excellent dielectric properties;

The main purpose:

1, CPU and heat sink interstitial, high-power triode, thyristor components, diodes and substrate (aluminum, copper) contacts in the filling of the gap, as the power amplifier tube and heat sink, semiconductor refrigeration, etc.;