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Home >> Products >>Accessories Tools >>Solder >>Lead-free paste >> Medium temperature Soldering tin Lead free Solder paste Sn65Bi34Ag1
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Medium temperature Soldering tin Lead free Solder paste Sn65Bi34Ag1

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NO Lead free Solder paste Sn65Bi3
  • product manual
  • AVAILABLE SIZES



Product Application

Solder materials are indispensable in the production and maintenance work of the electronics industry. Generally speaking, the commonly used solder materials are tin-lead alloy solder, twisted solder, cadmium solder, silver solder, and copper solder.

The wire solder used in standard soldering operations is called Rosin core solder wire or solder wire. Solder is added to the solder. This flux consists of rosin and a small amount of active agent.

The temperature setting during welding is very important. The most suitable temperature for welding work is the melting point of the welding used + 50 degrees. The setting temperature of the iron head, due to the size of the soldering part, the power and performance of the soldering iron, the type of solder, and the type of wire, should be increased by 100 degrees on the basis of the above temperature.

The main products of solder are divided into three categories: solder wire, solder strip and solder paste. Applied to all kinds of electronic welding, suitable for manual welding, wave soldering, reflow soldering and other processes.


Raw material production


High-quality and high-purity tin ingot raw material fusion electrolysis special refining process, low welding speed, low residue, wettability, good conductivity and thermal conductivity

Low residue, high insulation resistance


Less residue after welding, transparent appearance, high insulation resistance, no corrosion of PCB, can meet the requirement of no-clean

Moderate viscosity, no slump, no offset

Long time of continuous printing, no collapse within a few hours after printing, small changes in viscosity, and less likely to cause chip components to shift.

Strong wettability, good performance

Good wettability, excellent welding performance, good ICT test performance, no misjudgment.







ingredient
(WT%)
Melting point
(℃)
Application scenario





Lead paste
Sn63Pb37
183
Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding
Sn62.6Pb37Ag0.4
183-190
Sn60Pb40
183-203
Sn55Pb45
183-215
Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding
Sn50Pb50
183-227
Sn45Pb55
183-238



Lead-free solder paste
Sn99Ag0.3Cu0.7
183-248
Low cost, high melting point. Can be used for less demanding welding
Sn96.5Ag3.0Cu0.5
183-258
High cost, good performance, suitable for high-demand welding
Sn64.7Ag0.3Bi35
183-266
Good performance, low melting point, and finer lattice alloys
Sn64Ag1.0Bi35
183-279
High cost, good performance, commonly used lead-free solder
Sn42Bi58
227
Prevent corrosion by CU, suitable for low temperature welding

 


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